China Wholesale Gigabit RJ45 SFP Quotes Manufacturer - 40G QSFP+ SR4, 300m MPO 850nm JHAQC01 - JHA

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Features:                                               ◊ Compliant to the 40GbE XLPPI electrical specification per IEEE 802.3ba-2010 ◊ Compliant to QSFP+ SFF-8436 Specification ◊ Aggregate bandwidth of > 40Gbps ◊ Operates at 10.3125 Gbps per electrical channel with 64b/66b encoded data ◊ QSFP MSA compliant ◊ Capable of over 100m transmission on OM3 Multimode Fiber (MMF)and 150m on OM4 MMF ◊ Single +3.3V power supply operating   ◊ Without digital diagnostic functions   ◊ Temperature range 0°C to 70°C   ◊ RoHS Compliant Part ◊ Utilizes a standard LC duplex fiber cable allowing reuse of existing cable infrastructure Applications: ◊ 40 Gigabit Ethernet interconnects ◊ Datacom/Telecom switch & router connections ◊ Data aggregation and backplane applications ◊ Proprietary protocol and density applications Description: It is a Four-Channel,Pluggable, LC Duplex, Fiber-Optic QSFP+ Transceiver for 40 Gigabit Ethernet Applications. This transceiver is a high performance module for short-range duplex data communication and interconnect applications. It integrates four electrical data lanes in each direction into transmission over a single LC duplex fiber optic cable. Each electrical lane operates at 10.3125 Gbps and conforms to the 40GE XLPPI interface. The transceiver internally multiplexes an XLPPI 4x10G interface into two 20Gb/s electrical channels, transmitting and receiving each optically over one simplex LC fiber using bi-directional optics. This results in an aggregate bandwidth of 40Gbps into a duplex LC cable. This allows reuse of the installed LC duplex cabling infrastructure for 40GbE application. Link distances up to 100 m using OM3 and 150m using OM4 optical fiber are supported. These modules are de- signed to operate over multimode fiber systems using a nominal wavelength of 850nm on one end and 900nm on the other end. The electrical interface uses a 38 contact QSFP+ type edge connector. The optical interface uses a conventional LC duplex connector. Transceiver Block Diagram • Absolute Maximum Ratings Parameter Symbol Min. Typical Max. Unit Storage Temperature TS -40   +85 °C Supply Voltage VCCT, R -0.5   4 V Relative Humidity RH 0   85 % • Recommended Operating Environment: Parameter Symbol Min. Typical Max. Unit Case operating Temperature TC 0   +70 °C Supply Voltage VCCT, R +3.13 3.3 +3.47 V Supply Current ICC     1000 mA Power Dissipation PD     3.5 W • Electrical Characteristics (TOP = 0 to 70 °C, VCC = 3.13 to 3.47 Volts Parameter Symbol Min Typ Max Unit Note Data Rate per Channel   - 10.3125 11.2 Gbps   Power Consumption   - 2.5 3.5 W   Supply Current Icc   0.75 1.0 A   Control I/O Voltage-High VIH 2.0   Vcc V   Control I/O Voltage-Low VIL 0   0.7 V   Inter-Channel Skew TSK     150 Ps   RESETL Duration     10   Us   RESETL De-assert time       100 ms   Power On Time       100 ms   Transmitter Single Ended Output Voltage Tolerance   0.3   4 V 1 Common mode Voltage Tolerance   15     mV   Transmit Input Diff Voltage VI 120   1200 mV   Transmit Input Diff Impedance ZIN 80 100 120     Data Dependent Input Jitter DDJ     0.1 UI   Data Input Total Jitter TJ     0.28 UI   Receiver Single Ended Output Voltage Tolerance   0.3   4 V   Rx Output Diff Voltage Vo   600 800 mV   Rx Output Rise and Fall Voltage Tr/Tf     35 ps 1 Total Jitter TJ     0.7 UI   Deterministic Jitter DJ     0.42 UI   Note: 20~80% • Optical Parameters(TOP = 0 to 70 °C, VCC = 3.0 to 3.6 Volts) Parameter Symbol Min Typ Max Unit Ref. Transmitter Optical Wavelength CH1 λ 832 850 868 nm   Optical Wavelength CH2 λ 882 900 918 nm   RMS Spectral Width Pm   0.5 0.65 nm   Average Optical Power per Channel Pavg -4 -2.5 +5.0 dBm   Laser Off Power Per Channel Poff     -30 dBm   Optical Extinction Ratio ER 3.5     dB   Relative Intensity Noise Rin     -128 dB/HZ 1 Optical Return Loss Tolerance       12 dB   Receiver Optical Center Wavelength CH1 λ 882 900 918 nm   Optical Center Wavelength CH2 λ 832 850 868 nm   Receiver Sensitivity per Channel R   -11   dBm   Maximum Input Power PMAX +0.5     dBm   Receiver Reflectance Rrx     -12 dB   LOS De-Assert LOSD     -14 dBm   LOS Assert LOSA -30     dBm   LOS Hysteresis LOSH 0.5     dB    Note 12dB Reflection  Page02 is User EEPROM and its format decided by user. The detail description of low memory and page00.page03 upper memory please see SFF-8436 document. • Timing for Soft Control and Status Functions Parameter Symbol Max Unit Conditions Initialization Time t_init 2000 ms Time from power on1, hot plug or rising edge of Reset until the module is fully functional2 Reset Init Assert Time t_reset_init 2 μs A Reset is generated by a low level longer than the minimum reset pulse time present on the ResetL pin. Serial Bus Hardware Ready Time t_serial 2000 ms Time from power on1 until module responds to data transmission over the 2-wire serial bus Monitor Data ReadyTime t_data 2000 ms Time from power on1 to data not ready, bit 0 of Byte 2, deasserted and IntL asserted Reset Assert Time t_reset 2000 ms Time from rising edge on the ResetL pin until the module is fully functional2 LPMode Assert Time ton_LPMode 100 μs Time from assertion of LPMode (Vin:LPMode =Vih) until module power consumption enters lower Power Level IntL Assert Time ton_IntL 200 ms Time from occurrence of condition triggering IntL until Vout:IntL = Vol IntL Deassert Time toff_IntL 500 μs toff_IntL 500 μs Time from clear on read3 operation of associated flag until Vout:IntL = Voh. This includes deassert times for Rx LOS, Tx Fault and other flag bits. Rx LOS Assert Time ton_los 100 ms Time from Rx LOS state to Rx LOS bit set and IntL asserted Flag Assert Time ton_flag 200 ms Time from occurrence of condition triggering flag to associated flag bit set and IntL asserted Mask Assert Time ton_mask 100 ms Time from mask bit set4 until associated IntL assertion is inhibited Mask De-assert Time toff_mask 100 ms Time from mask bit cleared4 until associated IntlL operation resumes ModSelL Assert Time ton_ModSelL 100 μs Time from assertion of ModSelL until module responds to data transmission over the 2-wire serial bus ModSelL Deassert Time toff_ModSelL 100 μs Time from deassertion of ModSelL until the module does not respond to data transmission over the 2-wire serial bus Power_over-ride orPower-set Assert Time ton_Pdown 100 ms Time from P_Down bit set 4 until module power consumption enters lower Power Level Power_over-ride or Power-set De-assert Time toff_Pdown 300 ms Time from P_Down bit cleared4 until the module is fully functional3 Note: 1. Power on is defined as the instant when supply voltages reach and remain at or above the minimum specified value. 2. Fully functional is defined as IntL asserted due to data not ready bit, bit 0 byte 2 de-asserted. 3. Measured from falling clock edge after stop bit of read transaction. 4. Measured from falling clock edge after stop bit of write transaction. • Pin Assignment   Diagram of Host Board Connector Block Pin Numbers and Name • Pin Description Pin Logic Symbol Name/Description Ref. 1   GND Ground 1 2 CML-I Tx2n Transmitter Inverted Data Input   3 CML-I Tx2p Transmitter Non-Inverted Data output   4   GND Ground 1 5 CML-I Tx4n Transmitter Inverted Data Output   6 CML-I Tx4p Transmitter Non-Inverted Data Output   7   GND Ground 1 8 LVTTL-I ModSelL Module Select   9 LVTTL-I ResetL Module Reset   10   VccRx +3.3V Power Supply Receiver 2 11 LVCMOS-I/O SCL 2-Wire Serial Interface Clock   12 LVCMOS-I/O SDA 2-Wire Serial Interface Data   13   GND Ground 1 14 CML-O Rx3p Receiver Inverted Data Output   15 CML-O Rx3n Receiver Non-Inverted Data Output   16   GND Ground 1 17 CML-O Rx1p Receiver Inverted Data Output   18 CML-O Rx1n Receiver Non-Inverted Data Output   19   GND Ground 1 20   GND Ground 1 21 CML-O Rx2n Receiver Inverted Data Output   22 CML-O Rx2p Receiver Non-Inverted Data Output   23   GND Ground 1 24 CML-O Rx4n Receiver Inverted Data Output   25 CML-O Rx4p Receiver Non-Inverted Data Output   26   GND Ground 1 27 LVTTL-O ModPrsL Module Present   28 LVTTL-O IntL Interrupt   29   VccTx +3.3V Power Supply Transmitter 2 30   Vcc1 +3.3V Power Supply 2 31 LVTTL-I LPMode Low Power Mode   32   GND Ground 1 33 CML-I Tx3p Transmitter Inverted Data Output   34 CML-I Tx3n Transmitter Non-Inverted Data Output   35   GND Ground 1 36 CML-I Tx1p Transmitter Inverted Data Output   37 CML-I Tx1n Transmitter Non-Inverted Data Output   38   GND Ground 1  Notes: GND is the symbol for single and supply(power) common for QSFP modules, All are common within the QSFP module and all module voltages are referenced to this potential otherwise noted. Connect these directly to the host board signal common ground plane. Laser output disabled on TDIS >2.0V or open, enabled on TDIS <0.8V. VccRx, Vcc1 and VccTx are the receiver and transmitter power suppliers and shall be applied concurrently. Recommended host board power supply filtering is shown below. VccRx, Vcc1 and VccTx may be internally connected within the QSFP transceiver module in any combination. The connector pins are each rated for maximum current of 500mA. •  Recommended Circuit  Mechanical Dimensions  

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